Document Type
Poster
Publication Title
Northrop Grumman Engineering & Science Student Design Showcase
Abstract
There is a problem with the cooling system for CERN’s CMS Phase II Inner Tracker detector chip. This detector relies on tiny silicon chips that generate heat while collecting data. The chip sits on a layered structure designed to pull heat away, but this structure isn't working as efficiently as needed.[1] I propose a new way to bond these materials using a special type of metal-based thermal paste called Bi58 solder.
Advisor
Souvik Das
Publication Date
4-25-2025
Recommended Citation
Chickaway, Elliyonna Lacie, "Investigating a Novel Radiation-hard, High Thermal Conductivity Weld for Particle Physics Experiments" (2025). Aerospace, Physics, and Space Science Student Publications. 58.
https://repository.fit.edu/apss_student/58